CanaryTec Co., Ltd

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Microwave Dielectric Ceramic


-- Heat Sink / Chip Carrier / Solder


--Application
⊙ Adjust vertically, matching the Coefficient of Thermal Expansion.

--Features
⊙ Small size, Good Solderability and Bonding.

--Base Material Parameters
Classify	Code	Base Material Item	Density	CTE	Thermal Conductivity	Hardness
Classify	Code	Base Material Item	g/cm3	PPM/℃	W/mK	Hardness
Ceramic	B	99.6% AL2O3	3.90	7.5	29.3	* 83 GPa
	D	99.0% ALN	3.33	4.6	170	* 73 GPa
	F	99.5% BeO	2.85	6.8	270	* 82 Gpa
Metal	P	W80:Cu20	15.15	8.3	200	220 HB
	Q	W85:Cu15	15.90	7.3	190	240 HB
	R	Mo80%:20%	9.96	7.6	204	174 HB
	S	Mo85%:15%	10.01	7.0	195	156 HB
	T	CMC 13:74:13	9.88	5.6	200	——
	U	OFC TU1/TU2	8.90	16.7	397	102 HB
	V	Kovar 4J29	8.30	5.3	17	155 HB
	W	Au80%:Sn20%	14.5	16	57	276 HB
【*】The ROCKWELL 45 N method test.

--Type, Size and Au layer thickness

		C Type		D Type

Classify		Ceramic		Metal
Long & Width-inch (mm)		＞0.020" (0.50)		0.008" (0.20)~0.8"(20.0)
Thickness-inch (mm)		0.005"(0.127), 0.010"(0.254), 0.015"(0.381), 0.020"(0.508), 0.025"(0.635)		0.006"(0.15)，0.008"(0.20), 0.012"(0.30), 0.016"(0.40), 0.020"(0.50), 0.0315"(0.80), 0.040"(1.0), 0.0472"(1.2)
Au layer thickness-inch (um)		＞0.0001" (2.54)		＞ 0.00005"(1.30)

--Typical Products
No.	Code No.		Technical Data
1	M030030B010D		--99.6% AL2O3, D Type, Size: 0.030"×0.030"×0.010".
2	M125125D010D		--99.0% ALN, D Type, Size: 0.125"×0.125"×0.010".
3	M118040F010D		--99.5% BeO, D Type, Size: 0.118"×0.040"×0.010".
4	M125063P008C		--W80:Cu20 , C Type, Size: 0.125"×0.63"×0.008".
5	M084080R008C		--OFC TU1, C Type, Size: 0.084"×0.080"×0.008".
6	M060050S008C		--Kovar 4J29, C Type, Size: 0.060"×0.050"×0.008".